april 2010 doc id 12835 rev 4 1/7 7 emif02-av01f3 dual audio and video line ipad?, emi filter and esd protection features high-density capacitor emi low-pass filter and esd protection high-efficiency in emi filtering lead-free package 400 m pitch very small pcb footprint: 0.77 mm x 1.17 mm very thin package: 0.605 mm high reliability offered by monolithic integration reduction of parasitic elements thanks to csp integration complies with the following standards iec 61000-4-2 level 4 on external pin (a2, c2) ? 15 kv (air discharge) ? 8 kv (contact discharge) iec 61000-4-2 level 1 on internal pin (a1, c1) ? 2 kv (air discharge) ? 2 kv (contact discharge) application dual audio and video line interface protection and filtering in mobile phones description the emif02-av01f3 is a highly integrated array designed to suppress emi / rfi noise and provide impedance matching for mobile phones and portable applications. the emif02-av01f3 is in flip-chip package to offer space saving and high rf performance. additionally, this low-pass filter includes an esd protection circuitry to prevent damage to the application when subjected to esd surges up to 15 kv. figure 1. pin configuration (bump side view) figure 2. schematic tm : ipad is a trademark of stmicroelectronics. flip chip 5 bumps 12 a b c r b2 gnd a1 r a2 c c1 c2 15 kv c 15 kv 2 kv 2 kv www.st.com
characteristics emif02-av01f3 2/7 doc id 12835 rev 4 1 characteristics figure 3. electrical characteristics (definitions) table 1. absolute maximum ratings (t amb = 25 c) symbol parameter value unit v pp internal pins (a1, c1) esd discharge iec 61000-4-2, air discharge esd discharge iec 61000- 4-2, contact discharge external pins (a2, c2) esd discharge iec 61000-4-2, air discharge esd discharge iec 61000- 4-2, contact discharge 2 2 15 8 kv t j maximum junction temperature 125 c p tot total power dissipation 200 mw t op operating temperature range - 40 to + 85 c t stg storage temperature range - 55 to 150 c table 2. electrical characteristics (values, t amb = 25 c) symbol test conditions min. typ. max. unit v br i r = 1 ma 14 18 v i rm v rm = 3 v per line 0.5 a r i/o 12 15 18 c line v line = 0 v, v osc = 30 mv, f = 100 khz 2.56 3.2 3.84 nf symbol parameter v = breakdown voltage i = leakage current @ v v = stand-off voltage c = line capacitance br rm rm rm line i v v br v rm i r i rm i rm i r v rm v br
emif02-av01f3 characteristics doc id 12835 rev 4 3/7 figure 4. attenuation simulation with 1 k input and 10 k ouput figure 5. analog crosstalk db 10 100 1k 10k 100k 1m 10m 100m 1g -80 -70 -60 -50 -40 -30 -20 -10 0 f (hz) 50 simulations 50 measurements input: 1 k output: 10 k ac simulation 1.0m 3.0m 10.0m 30.0m 100.0m 300.0m 1.0g 3.0g -100.00 -90.00 -80.00 -70.00 -60.00 -50.00 -40.00 -30.00 -20.00 -10.00 0.00 xtalk 1/2 f (hz) db figure 6. digital crosstalk figure 7. esd response to iec 61000-4-2 (+15 kv air discharge) on one input (v in ) and one output (v out ) c1 c2 vin = 1 v/div v out = 5 mv/div a1-a2 line c1-c2 line 50 s/div 50 s/div input : 10 v/div 100 ns/div output : 10 v/div 100 ns/div input : 10 v/div 100 ns/div output : 10 v/div 100 ns/div figure 8. esd response to iec 61000-4-2 (-15 kv air discharge) on one input (v in ) and one output (v out ) figure 9. line capacitance versus applied voltage input : 10 v/div 100 ns/div output : 10 v/div 100 ns/div input : 10 v/div 100 ns/div output : 10 v/div 100 ns/div 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0123456 c line (nf) f=100 khz v osc =30 mv rms t j =25 c v line (v)
ordering information scheme emif02-av01f3 4/7 doc id 12835 rev 4 2 ordering information scheme figure 10. ordering information scheme 3 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 11. package dimensions emif yy - xx zz fx emi filter number of lines information package x = resistance value (ohms) z = capacitance value / 10 (pf) or 2 letters = application 2 digits = version f = flip chip x = 3: lead-free, pitch = 400 m, bump = 255 m 1170 m 30 m 770 m 30 m 255 m 40 400 m 40 400 m 40 605 m 55 185 m 185 m
emif02-av01f3 ordering information doc id 12835 rev 4 5/7 figure 14. flip chip tape and reel specification note: note: more information is av ailable in the application note: an2348:"flip chip: package description and recommendations for use" an1751: ?emi filters: recommendations and measurements? 4 ordering information figure 12. footprint figure 13. marking 220 m recommended 220 m recommended 260 m maximum solder stencil opening: copper pad diameter: solder mask opening: 300 m minimum x y x w z w dot xx = marking yww = datecode (y = year ww = week) z = manufacturing location e 4.0 0.1 8.0 0.3 1.75 0.1 3.5 - 0.1 ? 1.5 0.1 0.69 0.05 0.87 st 1.27 xxz yww e st xxz yww e st xxz yww e st xxz yww e 4.0 0.1 dot identifying pin a1 location table 3. ordering information order code marking package we ight base qty delivery mode eimf02-av01f3 hh flip chip 1. 4 mg 5000 tape and reel 7?
revision history emif02-av01f3 6/7 doc id 12835 rev 4 5 revision history table 4. document revision history date revision changes 06-oct-2006 1 initial release. 11-oct-2006 2 corrected test conditions for c line in table 2. 17-apr-2008 3 updated ecopack statement. updated figure 10 , figure 11 and figure 14. reformatted to current standards. 08-apr-2010 4 updated dimensions on page 1 and figure 4 , figure 11 , figure 14 .
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